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| Customization: | Available |
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| Application: | Automobile, Construction, Fiber & Garment, Footwear & Leather, Packing, Woodworking, Construction, Woodworking, Footwear & Leather, Fib |
| Bonding Function: | Structural Adhesive, Potting Adhesive, Sealant |
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| Properties | Test Standard | PART A | PART B |
| Before mixing | |||
| Appearance | \ | Black Liquid | brown liquid |
| Viscosity, cps, 25ºC | GB/10247-2008 | 95,000±25,000 | 1,500±500 |
| Density, g/cm3 , 25ºC | GB/T 13354-92 | 1.65±0.05 | 1.05±0.05 |
| After mixing | |||
| Mix rate, by weight | \ | A : B = 5 : 1 | |
| Viscosity after mixing, 25ºC | GB/10247-2008 | 8,000-10,000 | |
| Potting time,100g, min, 25ºC | GB/T13477.5-2002 | 35± 10 | |
| Cured condition | GB/T13477.5-2002 | 24h(25ºC)/ 30min(80ºC) | |
| After cured Test after curing 7days | |||
| Hardness, shore D | GB/T 531.1-2008 | 80 | |
| Thermal Conductivity, W/K.T | GB/T 10297-1998 | 0.40 | |
| Hydrophilic rate ,24hr/25ºC | GB/T 8810-2005 | < 0.3 % | |
| Dielectric strength, kV/mm,25ºC | GB/T 1693-2007 | >18 | |
| Volume resistance, DC500V,Ω·CM | GB/T 1692-92 | 1.0×1014 | |
| Tensile strength, Mp | GB 6328-86 | >35 | |
| Elongation,% | GB/T 528-1998 | 0.8 | |
| Shear strength, N/mm | GB 6328-86 | >10 | |
| Temperature Range,ºC , Service Temp: Occasional: |
DSC |
Up to 120ºC Up to 135ºC |
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| Coefficient of Thermal Expansion | GB/T 20673-2006 | 60 | |
| ITEM NO | APPLICATION | PERFORMANCE CHARACTERISTICS |
| 3102 General purpose | For general electronic components potting and circuit board closure. Room temperature can be cured, curing process exothermic temperature is low, low shrinkage |
Cured bright surface,no cracking, moisture,insulation |
| 3105 Thermal type |
For high-power electronic components on the heat requirements of the higher modules and circuit board potting protection. |
After the glue has cured heat dissipation, and other properties, like 3102 |
| 3108 Transparent type |
Required for a transparent potting of electronic components and modules, particularly for use in normal lighting requirements transparent potting |
Room temperature curing, curing after the high transparency, other properties ,like 3102 |
| 3115 Heat-resistant type |
For general heat-resistant electronic components potting and circuit board closed |
Mixing glue after a long time to use, heated at 80 ºC in 2 to 3 hours full curing, and could be used at temperature 180 ºC . |
| 3112 Flame retardant type |
For the requirements of flame retardant small and medium-sized electronic devices potting and circuit board closed, such as capacitor enclosures, solid state relay potting, etc |
Otherproperties like 3102 |
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