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| Customization: | Available |
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| Application: | Automobile, Construction, Fiber & Garment, Footwear & Leather, Packing, Woodworking, , Construction, Woodworking, Footwear & Leather, F |
| Bonding Function: | Structural Adhesive, Potting Adhesive, Sealant |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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| Before solidification | Test items test criteria unit PART A PART B | ||
| Color measurement black liquid light yellow liquid | |||
| Viscosity GB/T 10247-2008 25ºC,mPa·s 40,000±10,000 100±50 | |||
| Density GB/T 13354-92 25ºC,g/cm3 2.6±0.1 0.95±0.05 | |||
| Mix ratio mass ratio Ratio=A:B 100 :5 | |||
| Mixing viscosity GB/T 10247-2008 25ºC,mPa·s 6,000±1,500 | |||
| Operation time GB/T 10247-2008 25ºC, min 60 | |||
| After curing | Hardness GB/T 531.1-2008 Shore D 90 | ||
| Thermal conductivity GB/T W/mK 2.0 | |||
| Expansion coefficient GB/T 20673-2006 μm/ (m,ºC) | 25, < Tg 62, > Tg |
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| Glass transition temperature DSC ºC | 95, curing 80ºC 3hr; 105, curing 120ºC 2hr; |
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| Cutting strength GB 6328-86 Cutting strength GB 6328-86 | MPa ,Fe-Fe MPa,Al-Al |
≥10 ≥8 |
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| Dielectric strength GB/T 1693-2007 kv/mm (25ºC) ≥18 | |||
| Loss factor GB/T 1693-2007 (1MHz)(25ºC) 0.09 | |||
| Dielectric constant GB/T 1693-2007 (1MHz) (25ºC) 3.1 3.1 | |||
| Volume resistance GB/T 1692-92 DC500V, Ω · cm 1.00E +15 | |||
| Use temperature GBT 20028-2005 ºC -50--180 | |||
| ITEM NO | APPLICATION | PERFORMANCE CHARACTERISTICS |
| 3102 General purpose | For general electronic components potting and circuit board closure. Room temperature can be cured, curing process exothermic temperature is low, low shrinkage |
Cured bright surface,no cracking, moisture,insulation |
| 3105 Thermal type |
For high-power electronic components on the heat requirements of the higher modules and circuit board potting protection. |
After the glue has cured heat dissipation, and other properties, like 3102 |
| 3108 Transparent type |
Required for a transparent potting of electronic components and modules, particularly for use in normal lighting requirements transparent potting |
Room temperature curing, curing after the high transparency, other properties ,like 3102 |
| 3115 Heat-resistant type |
For general heat-resistant electronic components potting and circuit board closed |
Mixing glue after a long time to use, heated at 80 ºC in 2 to 3 hours full curing, and could be used at temperature 180 ºC . |
| 3112 Flame retardant type |
For the requirements of flame retardant small and medium-sized electronic devices potting and circuit board closed, such as capacitor enclosures, solid state relay potting, etc |
Otherproperties like 3102 |








