Pure Epoxy Resin for Injection Molding - High-Gloss Decorative Ornament Manufacturing

• Customization: Available
• Application: Automobile, Construction, Fiber & Garment, Footwear & Leather, Packing, Woodworking, a, Construction, Woodworking,
• Bonding Function: Structural Adhesive, Potting Adhesive, Sealant
• Model NO.: JOME 3108
• Color: Black, White, Red, Transparent, Yellowish
• Composition: Organic Material, Inorganic Material
• Morphology: Solvent, Liquid State
• Material: Epoxy
• Classification: Room Curing
• Main Agent Composition: Thermosetting Resin
• Promoter Composition: Curing Agent
• Einecs: 51852-81-4
• Characteristic: Fixed
• Formula: C11h12o3
• CAS No.: 25068-38-6
• Transport Package: Bucket
• Specification: Part A: 20kg/plastic drum; Part B: 0.8kg/bottle
• Trademark: JOME
• Origin: China
• HS Code: 35069900
• Production Capacity: 100000
• Package Size: 29.00cm * 17.00cm * 25.00cm
• Package Gross Weight: 1.000kg

Product Description

Epoxy sealant is a high-strength, superior electrical performance, and high surface gloss adhesive formed by mixing epoxy resin and curing agent. This sealing adhesive can cure at room temperature and has characteristics such as high transparency, high adhesion, waterproofing, high temperature resistance, and corrosion resistance. Widely used in electronic and electrical equipment, it has strong structural support and mechanical protection capabilities after curing. Due to its relatively low price, it is widely used in the automotive industry, consumer electronics components, wind power equipment, aerospace and other fields to enhance the mechanical structural stability and performance stability of these components in harsh environments
Product description
JOME 3108 A/B series is a two-component solvent-free normal temperature curing epoxy structural adhesive, low viscosity, high hardness, chemical resistance and excellent mechanical properties.

Technical parameters before and after curing:

Before solidification	test item	testing standard	unit	JOME 3108 A	JOME 3108 B
	pigment	Measures	---	Colorless transparent liquid	Colorless transparent liquid
	dynamic viscosity	GB/T 10247-2008	25ºC ,  mPa ·s	5,000±1,000	120±30
	density	GB/T 13354-92	25ºC ,  g/cm3	1.14±0.05	1.00±0.05
	mixing ratio	mass ratio	Ratio=A:B	2 : 1
	Mix viscosity	GB/T 10247-2008	25ºC ,  mPa ·s	1, 100±300
	operate time	GB/T 10247-2008	25ºC ,  min/150g	50
After solidification	hardness	GB/T 531.1-2008	Shore D	80-90
	shear strength	GB 6328-86	MPa, Fe-Fe MPa, AL-AL	≥13 ≥10
	glass state temperature	GB/T 22567-2008	ºC	75
	Loss factor	GB/T 1693-2007	(1MHz) (25ºC)	0.05
	punch through voltage	GB/T 1693-2007	Kv/mm	20
	dielectric constant	GB/T 1693-2007	(1MHz) (25ºC)	3.1
	volume resistivity	GB/T 1692-92	DC500V,Ω · cm	2.00E +14
	end-use temperature	GBT 20028-2005	ºC	-40--120

Note: 1. The curing condition of the above data test is 80dc/1h.
           2. The data in the table is the measured data under a specific condition for reference only, and it is not guaranteed that the data obtained by customers in the actual use    process can be completely consistent with it.

 

ITEM NO	APPLICATION	PERFORMANCE             CHARACTERISTICS
3102   General purpose	For general electronic components potting and circuit board closure. Room temperature can be cured, curing process exothermic temperature is low, low shrinkage	Cured bright surface,no cracking, moisture,insulation
3105 Thermal type	For high-power electronic components on the heat requirements of the higher modules and circuit board potting protection.	After the glue has cured heat dissipation, and other properties, like 3102
3108 Transparent type	Required for a transparent potting of electronic components and modules, particularly for use in normal lighting requirements transparent potting	Room temperature curing, curing after the high transparency, other properties ,like 3102
3115 Heat-resistant type	For general heat-resistant electronic components potting and circuit board closed	Mixing glue after a long time to use, heated at 80  ºC in 2 to 3  hours full curing, and could be  used at temperature 180  ºC .
3112 Flame       retardant type	For the requirements of flame retardant small and medium-sized electronic devices potting and circuit board closed, such as  capacitor enclosures, solid state relay potting, etc	Otherproperties like 3102

  
1. Are you a factory or trading company?
Yes. We are factory focus on the development and application of polymer materials and high-end electronic adhesives.

2.Any OEM/ODM service ?

JOME can offer the customer OEM label service,and will give the protection of the your right in your market.

3.How to be JOME's distributor ?

As the growing of JOME's global business,we need to find more and more distributors and agents worldwide. JOME will provide the best solution and service for our partners. For more information, pls contact with us directly

 

4.How to get  samples ?

Contact with us to get  samples

 

5.Delivery time ?

Normally, delivery time of sample order is 3 to 7 days, standard order is 7-20 days.

 

6. How to proceed an order?
Firstly let us know your requirements. Secondly we quote according to your requirements or our
suggestions. Thirdly customer confirmed the details and pay deposit for order. Fourthly we arrange
the production then you pay balance to us before shipment.

7. Shipment:
By Express: DHL, UPS, Fedex, TNT, EMS, Ect.
If your order is big, we'll advise you to use Air or Sea shipping through your nominated forwarder
agent.Our long-term cooperated agent is also available.