Transparent, Soft and Elastic Polyurethane Potting Adhesive Is Used for Sealing The Control PCB Boards of Household Appliances, Range Hoods and Stoves

Product Description

Transparent polyurethane sealant has low hardness, moderate strength, good elasticity, water resistance, mold resistance, shock resistance, transparency, as well as excellent electrical insulation and flame retardancy. It has no corrosive effect on electrical components and has good adhesion to metals such as steel, aluminum, copper, tin, as well as materials such as rubber, plastic, and wood. Transparent polyurethane sealant is used in situations that require transparent protection, such as sealing and protecting electronic components. It can provide excellent protection while maintaining transparency, making it easy to observe and detect the working status of electronic components.

Product Description
JOMP2030 is two-component soIvent-free  potting  resin.  It  cures  in  room  temperature  or heating temperature. It's using for eIectronics seaIing, potting, fIame resistant etc. The raw materiaI does     not contain heavy metaI, it's environmentaI with wideIy operabiIity, high physicaI properties of the    finished product, good adhesion with substrates. It can be deep cured, Iess heat reIease when
curing, Iow shrinkage rate. ExceIIent fIexibiIity after curing with fIame retardant efficiency.
Key Features
1. ExceIIent Iow temperature and weather resistance properties.
2. ExceIIent fIame retardant efficiency UL 94 V-0
3. ExceIIent eIectricaI insuIation
4. Good waterproof, moisture resistance, very Iow water absorption
5. Good adhesion to aImost metaI and pIastic.
TypicaI AppIications
1. For eIectronic capacitor, automotive eIectronics modeIs potting;
2. For househoId appIiances PCB potting, such as IampbIack cookers, microwave oven, eIectric cooker, washing machine, air-condition.
3. Moisture-proof and water-proof for PCB and magnetic induction Ioop of inteIIigent cIose stooI, induction toiIet, metaI induction garbage can encapsuIate and protection.

TechnicaI Data TabIe

PROPERTY	STANDARD/UNITS	JOMP2030
----	----	PART A	PART B
Appearance	VisuaI inspection	Light yeIIow fIuid	cIear fIuid
		A+B    Light yeIIow sub-transparent fIuid
Viscosity	25.C, cps	450	10
Density	25.C, g/cm3	0.99±0.05	1.22±0.05
Mixture ratio	Mass ratio	A:B=4:1
Viscosity of mixture	25.C, cps	250±50
Operation time	25.C, min	15±3
GeI time	25.C min, 100g	20±4
Cure condition	25.C/h, 100g	25.C / 24 h 80ºC / 45mins

 

Property after cured
Hardness	Shore-A	23
Water absorption	24hrs, 25.C,%	<0.2%
Density	25.C, g/cm3	1.06 ± 0.05
DieIectric strength	25.C, kV/mm	16
FIame retardancy	UL-94, Grade	V-0
AppIication	.C	-50~100
ThermaI conductivity	W/m.K	0.2
VoIume resistivity	25.C,Ω·cm	1 × 1014
DieIectric constant	50Hz,25.C	2.45

Note:Above data was tested under certain conditions. (T&H 23.C,50%) Directions for Use
1. PreIiminary drying: pIease dry PCB and substrates which need to potting in 50.C condition,then put it in appIication pIace.
2. Mixture: mixing A and B according to mass ratio, to reducemix air, shouId verticaIIy stir as same direction about 2-3 minutes. The edge and bottom of container aIso shouId be stir weII, otherwise, it wiII appear partiaI non soIidified phenomenon. The entire operation process, A and B, mixer, stir tooI etc. aII shouId avoid getting to water and moisture. If working pIace has air-container, it wiII be better to keep constant temperature and humidity (T&H: 23.C,50%)
3. Defoaming: For demanding of smooth potting surface without bubbIes, the mixed materiaI shouId be defoamed under the vacuum pressure ≤-0.1mpa.  It's better to defoame by stirring aIong with vacuum together. (Suggest to use automatic mixing equipment, it not onIy can be mixed in proper precise proportion, and wiII not mix in air bubbIes)
4.Potting: Pouring the mixed seaIant into the devices,for compIex structure or big size devices, shouId be poured by times. Can use a hot air gun to eIiminate the surface fIoating bubbIes.
5. Both A and B part shouId be seaIed weII, if it cannot be used up one time, pIease cover up bung again, seaIed storage. EspeciaIIy the part B, pIease try to reduce the time of contact with the air every time operating process.
6. Mix A and B evenIy as mass ratio in a short time, the mixed resin shouId use up within operation time, or eIse it cannot be use.
7. The curing time is reIated to how many resin mixed and temperature, if the quantity is big and temperature is high, the curing time wiII be shorter; on the contrary, curing time wiII be Ionger.
8.   Uncured   resin   is   easy   to  cIean,  cured   resin  can   use   methyIene  dichIoride  cIeaning, soaking,softening, stripping.

9. Curing: 25 °C/ (24) h, or 80 °C/60minutes, the humidity should below 50%, the curing time would be extended in a lower temperature.
10. For equipment operation,after dovacuum separately in the container of A and B, then measuring and mixing to pot into the devices, curing in airing or tunnel kiln.

Packing and Storage
Part A-200kg/Bucket,
 Part B-190kg/Bucket

Part A---16kg/Pail
Part B---20kg/Pail
 

 

type	model number	Product Description	Color	Mix ratio (By weight)	Viscosity	Pot life 25ºC min,150g	Initial curing time 25ºC, 55%RH,hr	Complete curing time	Hardness	Thermal conductivity	Usage temperature
Filled PU Potting	JOMP 2606	0.8W thermal conductivity, flame retardant 94 V-0	black	100:20	3000cps	40min	6h	24h	82A	0.8W	-50~140ºC
	JOMP2321W	Rapid solidification	milky white	1:3	2000cps	5min	8-12min	24h	85A	0.4W	-60~120ºC
	JOMP 610	Slightly yellow transparent, flame retardant 94 V-0	Light yellow transparent	100:100	200cps	120min	6h	24h	40A	0.2W	-40~130ºC
	JOMP 410	High transparency, yellowing resistance, flame retardant V-0	transparent	100:50	600cps	30min	6h	24h-48h	25A	0.2W	-50~120ºC
	JOMP2700 CGW	80D high hardness	milky white	25:100	1500cps	40min	2h	24h	80D	0.6W	-60~135ºC
	JOMP 6650	1.2W high thermal conductivity	Black/White	100:10	2000cps	60-120min	4-8h	24h	45D	1.2W	-50~130ºC

 1. Are you a factory or trading company?
Yes. We are factory focus on the development and application of polymer materials and high-end electronic adhesives.

2.Any OEM/ODM service ?

JOME can offer the customer OEM label service,and will give the protection of the your right in your market.

3.How to be JOME's distributor ?

As the growing of JOME's global business,we need to find more and more distributors and agents worldwide. JOME will provide the best solution and service for our partners. For more information, pls contact with us directly

 

4.How to get  samples ?

Contact with us to get  samples

 

5.Delivery time ?

Normally, delivery time of sample order is 3 to 7 days, standard order is 7-20 days.

 

6. How to proceed an order?
Firstly let us know your requirements. Secondly we quote according to your requirements or our
suggestions. Thirdly customer confirmed the details and pay deposit for order. Fourthly we arrange
the production then you pay balance to us before shipment.

7. Shipment:
By Express: DHL, UPS, Fedex, TNT, EMS, Ect.
If your order is big, we'll advise you to use Air or Sea shipping through your nominated forwarder
agent.Our long-term cooperated agent is also available.