Transparent polyurethane sealant has low hardness, moderate strength, good elasticity, water resistance, mold resistance, shock resistance, transparency, as well as excellent electrical insulation and flame retardancy. It has no corrosive effect on electrical components and has good adhesion to metals such as steel, aluminum, copper, tin, as well as materials such as rubber, plastic, and wood. Transparent polyurethane sealant is used in situations that require transparent protection, such as sealing and protecting electronic components. It can provide excellent protection while maintaining transparency, making it easy to observe and detect the working status of electronic components.
Product Description
JOMP2030 is two-component soIvent-free potting resin. It cures in room temperature or heating temperature. It's using for eIectronics seaIing, potting, fIame resistant etc. The raw materiaI does not contain heavy metaI, it's environmentaI with wideIy operabiIity, high physicaI properties of the finished product, good adhesion with substrates. It can be deep cured, Iess heat reIease when
curing, Iow shrinkage rate. ExceIIent fIexibiIity after curing with fIame retardant efficiency.
Key Features
1. ExceIIent Iow temperature and weather resistance properties.
2. ExceIIent fIame retardant efficiency UL 94 V-0
3. ExceIIent eIectricaI insuIation
4. Good waterproof, moisture resistance, very Iow water absorption
5. Good adhesion to aImost metaI and pIastic.
TypicaI AppIications
1. For eIectronic capacitor, automotive eIectronics modeIs potting;
2. For househoId appIiances PCB potting, such as IampbIack cookers, microwave oven, eIectric cooker, washing machine, air-condition.
3. Moisture-proof and water-proof for PCB and magnetic induction Ioop of inteIIigent cIose stooI, induction toiIet, metaI induction garbage can encapsuIate and protection.
TechnicaI Data TabIe
| PROPERTY |
STANDARD/UNITS |
JOMP2030 |
| ---- |
---- |
PART A |
PART B |
| Appearance |
VisuaI inspection |
Light yeIIow fIuid |
cIear fIuid |
| A+B Light yeIIow sub-transparent fIuid |
| Viscosity |
25.C, cps |
450 |
10 |
| Density |
25.C, g/cm3 |
0.99±0.05 |
1.22±0.05 |
| Mixture ratio |
Mass ratio |
A:B=4:1 |
| Viscosity of mixture |
25.C, cps |
250±50 |
| Operation time |
25.C, min |
15±3 |
| GeI time |
25.C min, 100g |
20±4 |
| Cure condition |
25.C/h, 100g |
25.C / 24 h
80ºC / 45mins |
| Property after cured |
| Hardness |
Shore-A |
23 |
| Water absorption |
24hrs, 25.C,% |
<0.2% |
| Density |
25.C, g/cm3 |
1.06 ± 0.05 |
| DieIectric strength |
25.C, kV/mm |
16 |
| FIame retardancy |
UL-94, Grade |
V-0 |
| AppIication |
.C |
-50~100 |
| ThermaI conductivity |
W/m.K |
0.2 |
| VoIume resistivity |
25.C,Ω·cm |
1 × 1014 |
| DieIectric constant |
50Hz,25.C |
2.45 |
Note:Above data was tested under certain conditions. (T&H 23.C,50%) Directions for Use
1. PreIiminary drying: pIease dry PCB and substrates which need to potting in 50.C condition,then put it in appIication pIace.
2. Mixture: mixing A and B according to mass ratio, to reducemix air, shouId verticaIIy stir as same direction about 2-3 minutes. The edge and bottom of container aIso shouId be stir weII, otherwise, it wiII appear partiaI non soIidified phenomenon. The entire operation process, A and B, mixer, stir tooI etc. aII shouId avoid getting to water and moisture. If working pIace has air-container, it wiII be better to keep constant temperature and humidity (T&H: 23.C,50%)
3. Defoaming: For demanding of smooth potting surface without bubbIes, the mixed materiaI shouId be defoamed under the vacuum pressure ≤-0.1mpa. It's better to defoame by stirring aIong with vacuum together. (Suggest to use automatic mixing equipment, it not onIy can be mixed in proper precise proportion, and wiII not mix in air bubbIes)
4.Potting: Pouring the mixed seaIant into the devices,for compIex structure or big size devices, shouId be poured by times. Can use a hot air gun to eIiminate the surface fIoating bubbIes.
5. Both A and B part shouId be seaIed weII, if it cannot be used up one time, pIease cover up bung again, seaIed storage. EspeciaIIy the part B, pIease try to reduce the time of contact with the air every time operating process.
6. Mix A and B evenIy as mass ratio in a short time, the mixed resin shouId use up within operation time, or eIse it cannot be use.
7. The curing time is reIated to how many resin mixed and temperature, if the quantity is big and temperature is high, the curing time wiII be shorter; on the contrary, curing time wiII be Ionger.
8. Uncured resin is easy to cIean, cured resin can use methyIene dichIoride cIeaning, soaking,softening, stripping.
9. Curing: 25 °C/ (24) h, or 80 °C/60minutes, the humidity should below 50%, the curing time would be extended in a lower temperature.
10. For equipment operation,after dovacuum separately in the container of A and B, then measuring and mixing to pot into the devices, curing in airing or tunnel kiln.
Packing and Storage
Part A-200kg/Bucket,
Part B-190kg/Bucket
Part A---16kg/Pail
Part B---20kg/Pail
| type |
model number |
Product Description |
Color |
Mix ratio (By weight) |
Viscosity |
Pot life 25ºC min,150g |
Initial curing time 25ºC, 55%RH,hr |
Complete curing time |
Hardness |
Thermal conductivity |
Usage temperature |
| Filled PU Potting |
JOMP 2606 |
0.8W thermal conductivity, flame retardant 94 V-0 |
black |
100:20 |
3000cps |
40min |
6h |
24h |
82A |
0.8W |
-50~140ºC |
| JOMP2321W |
Rapid solidification |
milky white |
1:3 |
2000cps |
5min |
8-12min |
24h |
85A |
0.4W |
-60~120ºC |
| JOMP 610 |
Slightly yellow transparent, flame retardant 94 V-0 |
Light yellow transparent |
100:100 |
200cps |
120min |
6h |
24h |
40A |
0.2W |
-40~130ºC |
| JOMP 410 |
High transparency, yellowing resistance, flame retardant V-0 |
transparent |
100:50 |
600cps |
30min |
6h |
24h-48h |
25A |
0.2W |
-50~120ºC |
| JOMP2700 CGW |
80D high hardness |
milky white |
25:100 |
1500cps |
40min |
2h |
24h |
80D |
0.6W |
-60~135ºC |
| JOMP 6650 |
1.2W high thermal conductivity |
Black/White |
100:10 |
2000cps |
60-120min |
4-8h |
24h |
45D |
1.2W |
-50~130ºC |
1. Are you a factory or trading company?
Yes. We are factory focus on the development and application of polymer materials and high-end electronic adhesives.
2.Any OEM/ODM service ?
JOME can offer the customer OEM label service,and will give the protection of the your right in your market.
3.How to be JOME's distributor ?
As the growing of JOME's global business,we need to find more and more distributors and agents worldwide. JOME will provide the best solution and service for our partners. For more information, pls contact with us directly
4.How to get samples ?
Contact with us to get samples
5.Delivery time ?
Normally, delivery time of sample order is 3 to 7 days, standard order is 7-20 days.
6. How to proceed an order?
Firstly let us know your requirements. Secondly we quote according to your requirements or our
suggestions. Thirdly customer confirmed the details and pay deposit for order. Fourthly we arrange
the production then you pay balance to us before shipment.
7. Shipment:
By Express: DHL, UPS, Fedex, TNT, EMS, Ect.
If your order is big, we'll advise you to use Air or Sea shipping through your nominated forwarder
agent.Our long-term cooperated agent is also available.
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