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| Customization: | Available |
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| Application: | Automobile, Construction, Fiber & Garment, Footwear & Leather, Packing, Woodworking, Construction, Woodworking, Footwear & Leather, Fi |
| Bonding Function: | Structural Adhesive, Potting Adhesive, Sealant |
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Product Introduction
Before cured |
Item | Method | Unit | JOME 3113-1 A | JOME 3113-1 B |
| Appearance | Visual inspection | --- | Black Liquid | Beige paste | |
| Viscosity | GB/T 10247-2008 | 25τ , mPa ·s | 20,000±3,000 | 25 | |
| Density | GB/T 13354-92 | 25τ , g/cm3 | 2.35±0.05 | 0.93±0.05 | |
| Mix rate | Mass ratio | Ratio=A:B | 100 :8 | ||
| Mix viscosity | GB/T 10247-2008 | 25τ , mPa ·s | 2,000±300 | ||
| Operation time | GB/T 10247-2008 | 25τ , min | 45 | ||
| Gel time | GB/T 10247-2008 | 60τ , min | 60 | ||
After cured |
Hardness | GB/T 531.1-2008 | Shore D | 90 | |
| Thermal conductivity |
GB/T 10297- 1998 | W/mK | 1.2±0.1 | ||
| linear thermal expansion coefficient |
GB/T 20673-2006 | μm/( m ,τ) | 20 | ||
| glass transition temperature | DSC | τ | 95 | ||
| Shear strength | GB 6328-86 | Mpa ,Fe-Fe | ≥8 | |
| Shear strength | GB 6328-86 | Mpa ,Al-Al | ≥8 | |
| Dielectric strength | GB/T 1693-2007 | kV/mm(25τ) | ≥18 | |
| Loss factor | GB/T 1693-2007 | (1MHz)(25τ) | 0.09 | |
| Dielectric constant | GB/T 1693-2007 | (1MHz)(25τ) | 2.9 | |
| Volume resistance | GB/T 1692-92 | DC500V,Ω· cm | 1.00E +15 | |
| Applying temperature | GBT 20028-2005 | τ | -50-- 200 |
| ITEM NO | APPLICATION | PERFORMANCE CHARACTERISTICS |
| 3102 General purpose | For general electronic components potting and circuit board closure. Room temperature can be cured, curing process exothermic temperature is low, low shrinkage |
Cured bright surface,no cracking, moisture,insulation |
| 3105 Thermal type |
For high-power electronic components on the heat requirements of the higher modules and circuit board potting protection. |
After the glue has cured heat dissipation, and other properties, like 3102 |
| 3108 Transparent type |
Required for a transparent potting of electronic components and modules, particularly for use in normal lighting requirements transparent potting |
Room temperature curing, curing after the high transparency, other properties ,like 3102 |
| 3115 Heat-resistant type |
For general heat-resistant electronic components potting and circuit board closed |
Mixing glue after a long time to use, heated at 80 ºC in 2 to 3 hours full curing, and could be used at temperature 180 ºC . |
| 3112 Flame retardant type |
For the requirements of flame retardant small and medium-sized electronic devices potting and circuit board closed, such as capacitor enclosures, solid state relay potting, etc |
Otherproperties like 3102 |
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