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| Customization: | Available |
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| Application: | Automobile, Construction, Fiber & Garment, Footwear & Leather, Packing, Woodworking, Construction, Woodworking, Footwear & Leather, Fi |
| Bonding Function: | Structural Adhesive, Potting Adhesive, Sealant |
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| test item | 3102 | 3102 Slow | |
| Appearance, visual inspection | glue soluting A | White viscous colloid | White viscous colloid |
| glue soluting B | Colorless transparent liquid | Colorless or pale yellow transparent liquid | |
| Density, g/cm325ºC | glue soluting A | 1.85±0.05 | 1.85 ±0.05 |
| glue soluting B | 1.05 ±0.05 | 1.05 ±0.05 | |
| mixing ratio | mass ratio | 5:1 | 100:12 |
| Viscosity, cps 25ºC | glue soluting A | 11000 ±2000 | 11000 ±2000 |
| glue soluting B | 100±20 | 13 ±5 | |
| Mixing operation time, min/150g | 40 ± 10 | 170 ±20 | |
| Hardness, Shore-D | ≥70 | 85 ±5 | |
| Volume resistivity, Ω·cm, 25ºC | 3.1×1014 | 1.0×1014 | |
| Breakdown voltage, kV/mm, 25ºC | ≥ 18 | ≥ 18 | |
| Dielectric constant, 1.2MHz, 25ºC | 3-5 | 3-5 | |
| Dielectric loss tangent, 1.2MHz | <0.01 | <0.01 | |
| Curing shrinkage,% | <2 | <2 | |
| Thermal conductivity, W/K.T | 0.3-0.4 | 0.3-0.4 | |
| Cutting strength, Fe-Fe, MPa | ≥7 | ≥5 | |
| Check for bubbles on the surface of the cured block | deny | - | |
| Operating temperature range, ºC | -40 ~120 | -40 ~120 | |
| ITEM NO | APPLICATION | PERFORMANCE CHARACTERISTICS |
| 3102 General purpose | For general electronic components potting and circuit board closure. Room temperature can be cured, curing process exothermic temperature is low, low shrinkage |
Cured bright surface,no cracking, moisture,insulation |
| 3105 Thermal type |
For high-power electronic components on the heat requirements of the higher modules and circuit board potting protection. |
After the glue has cured heat dissipation, and other properties, like 3102 |
| 3108 Transparent type |
Required for a transparent potting of electronic components and modules, particularly for use in normal lighting requirements transparent potting |
Room temperature curing, curing after the high transparency, other properties ,like 3102 |
| 3115 Heat-resistant type |
For general heat-resistant electronic components potting and circuit board closed |
Mixing glue after a long time to use, heated at 80 ºC in 2 to 3 hours full curing, and could be used at temperature 180 ºC . |
| 3112 Flame retardant type |
For the requirements of flame retardant small and medium-sized electronic devices potting and circuit board closed, such as capacitor enclosures, solid state relay potting, etc |
Otherproperties like 3102 |
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