| Customization: | Available |
|---|---|
| CAS No.: | 25068-38-6 |
| Formula: | C11h12o3 |
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| ITEM NO | APPLICATION | PERFORMANCE CHARACTERISTICS |
| 3102 General purpose | For general electronic components potting and circuit board closure. Room temperature can be cured, curing process exothermic temperature is low, low shrinkage |
Cured bright surface,no cracking, moisture,insulation |
| 3105 Thermal type |
For high-power electronic components on the heat requirements of the higher modules and circuit board potting protection. |
After the glue has cured heat dissipation, and other properties, like 3102 |
| 3108 Transparent type |
Required for a transparent potting of electronic components and modules, particularly for use in normal lighting requirements transparent potting |
Room temperature curing, curing after the high transparency, other properties ,like 3102 |
| 3115 Heat-resistant type |
For general heat-resistant electronic components potting and circuit board closed |
Mixing glue after a long time to use, heated at 80 ºC in 2 to 3 hours full curing, and could be used at temperature 180 ºC . |
| 3112 Flame retardant type |
For the requirements of flame retardant small and medium-sized electronic devices potting and circuit board closed, such as capacitor enclosures, solid state relay potting, etc |
Otherproperties like 3102 |
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